Answer: there are many ways of grounding, including single point grounding, multi-point grounding and mixed type grounding. Single point grounding is divided into series single point grounding and parallel single point grounding. Generally speaking, single point grounding is used for simple circuits, grounding distinction between different functional modules, and low-frequency (f < 1MHz) electronic circuits. When designing high-frequency (F > 10MHz) circuits, it is necessary to use multi-point grounding or multilayer board (complete ground layer).
Q5: introduction of signal backflow and cross division
Answer: for an electronic signal, it needs to find a path for the lowest impedance current to return to the ground, so how to deal with the signal return becomes very critical.
First, according to the formula, the radiation intensity is directly proportional to the loop area, that is, the longer the return path, the larger the loop formed, and the greater the interference to external radiation. Therefore, the area between the power circuit and the signal circuit should be reduced as much as possible during PCB layout.
Second, for a high-speed signal, providing a good signal return can ensure its signal quality. This is because the characteristic impedance of the transmission line on the PCB is generally calculated with reference to the stratum (or power supply layer). If there is a continuous ground plane near the high-speed line, the impedance of the line can remain continuous. If there is no ground reference near the segment line, the impedance will change, The discontinuous impedance thus affects the integrity of the signal. Therefore, when wiring, the high-speed line shall be distributed to the layer near the ground plane, or one or two ground wires shall be laid beside the high-speed line to play the role of shielding and providing return flow nearby.
Third, why should we try not to divide the wiring across the power supply? This is also because after the signal crosses different power supply layers, its return path will be very long and easy to be disturbed. Of course, it is not strictly required not to cross the power supply division. It is possible for low-speed signals, because the generated interference can be ignored compared with the signal. For high-speed signals, it is necessary to carefully check them and try not to cross them. You can adjust the wiring of the power supply. (this is for multi-layer board power supply)
Q6: why and how to separate analog ground from digital ground?
Answer: both the analog signal and the digital signal should be returned to the ground. Because the digital signal changes rapidly, the noise caused on the digital ground will be very large, and the analog signal needs a clean reference work. If analog and digital are mixed together, noise will affect the analog signal.
Generally speaking, analog ground and digital ground should be processed separately, and then connected together through thin wiring or single point. The general idea is to try to block the noise from digital ground to analog ground. Of course, this is not very strict. The analog ground and the digital ground must be separated. If the digital ground near the analog part is still clean, it can be combined.
Q7: how is the signal on the single board grounded?
Answer: for general devices, the nearest grounding is the best. After adopting the multi-layer board design with complete ground plane, the grounding of general signals is very easy. The basic principle is to ensure the continuity of wiring and reduce the number of vias; Near the ground plane or the power plane, etc.
Q8: how is the interface device of the single board grounded?
Answer: some boards have external I / O interfaces, such as serial port connectors and network port RJ45 connectors. If their grounding is not well designed, their normal operation will also be affected. For example, there are code errors and packet losses in the network port interconnection, and they will become external electromagnetic interference sources, sending the noise in the board to the outside. Generally speaking, an independent interface ground will be separated separately, and the connection with the signal ground is connected by a thin wiring, and a resistance of 0 ohm or small resistance can be connected in series. The thin wiring can be used to block the signal ground noise from passing to the interface ground. Similarly, the filtering of interface ground and interface power supply shall also be carefully considered.