注:如图在 3V 应用中建议 CVM 电容至少用一个 0.1uF;在 4.5V 应用中至少用一个 1uF;在 6V 应用中至少用一个 4.7uF;在 9V 应用中至少用一个 22uF。均为使用贴片电容靠近 IC 之 VDD 管脚放置且电容的负极和 IC 的 GND端之间的连线也需尽量短。即不要电容虽然近,但布线、走线却绕得很远。当使用大电解插件电容时,建议再并一个 0.1uF 贴片电容于
CST2466/CST2466E 之 VM 脚上。 参考下图。
The capacitor C1 connected between the GND and the VM pins must be located as close as possible to the
CST2466/CST2466E chip. In different applications, C1(show as above) is recommended to use a 0.1uF in 3V applications; a 1uF is recommended for 4.5V applications; a 4.7uF is recommended for 6V applications; in 9.6V applications, it is recommended to use 22uF, all these capacitors should be SMD package. The connection between the negative pole of the capacitor and the GND terminal of the IC should be as short as possible. That is to say, the line route should not far away.
When the application board has capacitors while filtering for other chips that is far away from the
CST2466/CST2466E, it need to place a small capacitor for
CST2466/CST2466E.
The capacitor C3 preferably soldering to the motor poles instead of placing it on the PCB. When it is inconvenient to soldering on the motor poles, it can be mount on the PCB. The following diagram is the PCB layout reference .
CST2466 SOP8脚位图:
CST2466 SOP8 PIN DESCRIPTION: